PANEL SESSION

Innovation Session

Focused on how to innovate in an organization, this session will discuss the challenges faced specifically in the innovation stage of the business and technology development and how they have been overcome. We’ll discuss applications driving innovations in the semiconductor industry in areas such as Datacentre, Automotive, Sensing and Wireless Technologies.

MODERATOR

David Cheskis

TriEye

David Cheskis, PhD, serves as the Senior Product Director at TriEye Ltd. where he is responsible for new SWIR imaging products. Dr. Cheskis is an expert in semiconductor, optoelectronics and communications technologies, products and markets and started the first 6-inch GaAs VCSEL wafer foundry business in 2013. Since 1996, Dr. Cheskis has led the development of semiconductor and optical technologies and products for wireless, wireline and optical products at diverse sensing and communications companies including Lumentum, LeddarTech, IQE plc, II-VI Incorporated, ANADIGICS Inc, Oclaro Inc., Sarnoff Corporation, Jazz Semiconductor, Multilink Technology Corporation, and Vitesse Semiconductor. Dr. Cheskis earned PhD and MS degrees in Electrical Engineering from the University of California, San Diego and a BSEE degree in Microelectronic Engineering from Rochester Institute of Technology. He is a Senior Member of the IEEE. Contact: David.Cheskis@TriEye.tech

PANELLISTS INCLUDE

Diana Khlan

Chips Weekly

Diana Khlan is a Tech Expert, Entrepreneur, and Host of Chips Weekly — a fast-growing platform spotlighting semiconductor innovation, AI hardware, and the future of intelligent systems. With experience across chip technologies, product strategy, and emerging hardware ecosystems, Diana advocates for bridging hardware and AI communities to accelerate responsible, scalable innovation. Today she collaborates with global semiconductor leaders, startups, and open-tech initiatives to drive forward a more resilient and transparent tech future.

Manuel Gärtner

STMicroelectronics

Manuel Gärtner is Director of Wide Bandgap & Electrification for automotive applications at STMicroelectronics Munich. Leveraging his extensive expertise in smart power product development and advanced research from prestigious institutions such as the University of Berlin and Fraunhofer Institute ISiT, Manuel drives innovation and excellence in automotive power electronics at ST. His leadership accelerates ST’s position as a pioneer in wide bandgap technologies, enabling the company to deliver cutting-edge, energy-efficient solutions tailored for the automotive sector. With over 50 technical publications and multiple patents, Manuel contributes deep technical knowledge that fuels ST’s competitive edge and thought leadership. Beyond his technical impact, Manuel strengthens ST’s industry influence through active roles on the EEHE Scientific Advisory Board, the SIA POWER TRAIN & ELECTRONICS scientific committee, and the technical program committee for the upcoming CIPS 2026 Conference. As principal partner representative and board member of ECPE, he ensures ST’s strategic collaboration and visibility in the global power electronics ecosystem.

Michael Liehr

Combined Semiconductor

Dr. Michael Liehr is a strategist and executive advisor who specializes in helping leaders define and execute technical and business strategies. His work is built on a strong foundation of practical business experience, deep technical expertise, and transformational practices. Dr. Liehr is currently president, Liehr Consulting LLC, in Troy, NY, USA. He specializes in semiconductor (CMOS) and integrated photonics and has conducted reviews for the National Research Council, Canada, the U.S. National Academies of Sciences and Medicine, works with a Washington Consulting Firm specializing in CHIPS funding and is a contractor for the Federal Government and is for consulting commercial clients. He furthermore advises several start-ups, including Combined Semiconductor, Inc. Most recently, Dr. Liehr was the Chief Executive Officer of the American Institute for Manufacturing (AIM) of Integrated Photonics, the largest of fourteen centers under the Federal Integrated Manufacturing Initiative. As Principal Investigator he assembled a multi-partner team to pursue integrated photonics manufacturing technology, system integration, and business opportunities. He also served as State University of New York (SUNY) Polytechnic Institute’s Vice President for Research and Executive Vice President for Innovation and Technology, leading a team of over 350 engineers, technicians, and business managers. As part of this position, he led multiple large-scale negotiations with partner companies, government agencies and university research offices. Trained as a solid-state physicist in Aachen, Germany, his subsequent research career began at IBM Research, Yorktown Heights, where he pursued and then led innovative approaches to electronic materials and processing, followed by research management assignments in Manufacturing Research. In 1996 he transferred to IBM Microelectronics in Burlington, VT, in a sequence of research, development and manufacturing management positions that culminated in his status as IBM Distinguished Engineer. During this time, he was actively engaged with the IBM technology licensing group during contract negotiations and led the subsequent execution of the agreements with international partners. Subsequently he moved to SUNY in Albany as Principal Investigator of a Semiconductor Research Center for post-CMOS devices and General Manager of the Global 450mm Consortium.